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INTEGRATED CIRCUITS
DATA SHEET
TDA5330T VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
Product specification File under Integrated Circuits, IC02 January 1988
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
GENERAL DESCRIPTION
TDA5330T
The TDA5330T is a monolithic integrated circuit that performs the band A, band B and band C mixer/oscillator functions in TV and VCR tuners. This device gives the designer the capability to design an economical and physically small 3-band tuner which will be capable of meeting the most stringent requirements e.g. FTZ or FCC. The tuner development time can be drastically reduced by using this device. Features * Balanced mixer with a common emitter input for band A * Amplitude-controlled oscillator for band A * Balanced mixer with common base input for band B and C * Balanced oscillator for band B and C * Local oscillator buffer output for external prescaler * SAW filter preamplifier with an output impedance of 100 * Bandgap voltage stabilizer for oscillator stability * Electronic bandswitch QUICK REFERENCE DATA PARAMETER Supply voltage Band A frequency range Band B frequency range Band C frequency range Conversion noise Band A input voltage Band B and C input power Band A voltage gain Band B voltage gain Band C voltage gain PACKAGE OUTLINE 28-lead mini-pack , plastic (SO20; SOT163A); SOT 163-1; 1996 November 28. 1% cross-modulation 1% cross-modulation CONDITIONS fA fB fC F V24-26 PI Gv Gv Gv SYMBOL V19-2, 26 - 48 160 430 7 - - - - - MIN. - - - - 100 -21 24 37 36 TYP. 12 - 180 470 860 11 - - - - - MAX. V MHz MHz MHz dB dBV dBm dB dB dB UNIT
January 1988
2
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
TDA5330T
January 1988
3
Fig.1 Block diagram.
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
PINNING 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Fig.2 Pinning diagram. 26 27 28 A OSC GND A OSC B OSC B OSC B OSC B OSC C OSC C OSC C OSC C OSC BS IF OUT IF OUT IF IN IF IN MIX OUT MIX OUT VP C IN C IN B IN B IN A IN A IN RF GND LO OUT LO OUT
TDA5330T
band A oscillator input ground (0 V) band A oscillator output band B oscillator input band B oscillator output band B oscillator output band B oscillator input band C oscillator input band C oscillator output band C oscillator output band C oscillator input electronic bandswitch IF amplifier output IF amplifier output IF amplifier input IF amplifier input mixer output mixer output positive supply voltage band C input band C input band B input band B input band A input band A input ground for RF inputs local oscillator amplifier output local oscillator amplifier output
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage Switching voltage Output current of each pin to ground Maximum short-circuit time (all pins) Storage temperature range Operating ambient temperature range THERMAL RESISTANCE From junction to ambient in free air January 1988 4 Rth j-a typ. 75 K/W CONDITIONS V12 IO tSC Tstg Tamb SYMBOL VP = V19-2, 26 0 - - -55 -25 MIN. -0.3 MAX. 14 14 -10 10 +150 +80 V V mA s C C UNIT
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
CHARACTERISTICS VP = 12 V; Tamb = 25 C; unless otherwise specified. PARAMETER Supply voltage Supply current Switching voltage; band A band B band C Switching current; band C Band A Mixer (including IF amplifier) Frequency range Noise figure note 1; 50 MHz 180 MHz Optimum source conductance Input admittance Input capacitance Input voltage Input voltage Voltage gain Band A mixer Conversion transadmittance mixer Mixer output admittance Mixer output capacitance C17-18 - 2 pins 15 and 16 - 0.1 Sc = I17/V24 = -I18/V24 Sc24-17, 18 - 3.5 50 MHz 180 MHz see Fig.9 50 - 180 MHz 1% cross-modulation; in channel 10 kHz pulling; in channel 20 log (V13-14/V24) C24-26 V24-26 V24-26 Gv - 97 100 22.5 2 100 108 25.0 G24-26 G24-26 - - 0.5 1.1 NF NF - - 7.5 9 measured using circuit shown in Fig.9 fA 48 - I12 - - V12 V12 V12 0 1.6 3.0 - - - CONDITIONS I19 SYMBOL V19-2, 26 - MIN. 10 TYP. - 42
TDA5330T
MAX. 13.2 55 1.1 2.4 5.0 50 V
UNIT mA V V V A
180 9 10 - - - - - 27.5
MHz dB dB mS mS pF dBV dBV dB
- - -
mS mS pF
January 1988
5
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
PARAMETER Band A oscillator Frequency range Frequency shift Frequency drift Frequency drift Band B mixer (including IF) VP = 10% T = 25 C 5 s to 15 min after switching on measured using circuit shown in Fig.9 measurements using hybrid; note 2 Frequency range Noise figure pins 22 and 23; 200 MHz 470 MHz Input admittance Available input power see Fig.5 1% cross-modulation; in channel; pins 22 and 23; 200 MHz 470 MHz 10 kHz pulling pins 22 and 23; in channel; 470 MHz N+5 - 1 MHz pulling Voltage gain note 3; 430 MHz note 4; 200 MHz 470 MHz Band B oscillator Frequency range Frequency shift Frequency drift Frequency drift VP = 10% T = 25 C 5 s to 15 min after switching on fB f f f 200 - - - - - - - Gv Gv 33 33 36 36 - -11 - -11 PAI PAI -24 -24 -21 -21 NF NF - - 8 8 fB 160 - fA f f f 80 - - - - - - - CONDITIONS SYMBOL MIN. TYP.
TDA5330T
MAX.
UNIT
216 200 400 200
MHz kHz kHz kHz
470 10 10
MHz dB dB
- -
dBm dBm
- - 39 39
dBm dBm dB dB
500 400 500 200
MHz kHz kHz kHz
January 1988
6
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
PARAMETER Band C mixer (including IF) CONDITIONS measured using circuit shown in Fig.9; measurements using hybrid; note 2 Frequency range Noise figure pins 20 and 21; 430 MHz 860 MHz Input admittance Available input power see Fig.6 1% cross-modulation in channel; pins 20 and 21; 430 MHz 860 MHz 10 kHz pulling pins 20 and 21; in channel; 860 MHz N+5 - 1 MHz pulling Voltage gain note 3; 820 MHz note 4; 430 MHz 860 MHz Band C oscillator Frequency range Frequency shift Frequency drift Frequency drift Vb = 10% T = 25 C 5 s to 15 min after switching on note 5; differentially measured at 36 MHz; see Fig.7 S11 S12 S21 see Fig.8 S22 - - - - -0,5 -41 12 -9 -2.0 -7 160 10 fC f f f 470 - - - mod. IF Amplifier - - - - phase Gv Gv 33 33 36 36 -42 -35 - -20 PAI PAI -25 -25 -21 -21 NF NF - - 9 9 fC 430 - SYMBOL MIN. TYP.
TDA5330T
MAX.
UNIT
860 11 11
MHz dB dB
- -
dBm dBm
- - 39 39
dBm dBm dB dB
900 400 800 200
MHz kHz kHz kHz
Input reflection coefficient Reverse transmission coefficient Forward transmission coefficient Output reflection coefficient - dB/deg - dB/deg - dB/deg - dB/deg
January 1988
7
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
PARAMETER LO output Output voltage into 50 resistor Spurious signal on LO output with respect to LO output signal LO signal harmonics with respect to LO signal Notes 1. Measured with an input circuit for optimum noise. (see Fig.3). measured at 50 SHD - - V27-28 14 35 CONDITIONS SYMBOL MIN. TYP.
TDA5330T
MAX.
UNIT
100
mV
note 6
SRF
-
-
-10
dB
-10
dB
2. The values have been corrected for hybrid and cable losses. The symmetrical output impedance of the circuit is 100 . 3. The input level of a N+5 - 1 MHz signal (just visible). 4. The gain is defined as the transducer gain (measured in Fig.9) plus the voltage transformation ratio of L6 to L7 (6:1, 16 dB). 5. All S parameters are referred to a 50 system. 6. Measured with 50 output impedance on pins 26 and 27 and a RF input signal level of: RF level = 1 V at f < 180 MHz RF power = 0.5 dBm at 100 MHz < f < 225 MHz RF power = -10 dBm at 225 MHz < f < 860 MHz
Fig.3 Input circuit for optimum noise. Table 1 Component values F = 50 MHz 13 t, 5.5 mm, wire 0.7 mm rigid cable, 2.9 cm rigid cable, 4 cm 9.6 pF F = 180 MHz (note 1) (note 1) (note 1) (note 1)
COMPONENT L L2 L3 C Note 1. Value to be fixed. January 1988
8
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
Table 2 Electrical parameters of the circuit (for appropriate impedance and selectivity) PARAMETER Insertion loss Bandwidth Image suppression Output impedance (source for IC) Note 1. Value to be fixed. F = 50 MHz 0.3 8 15 2 F = 180 MHz (note 1) (note 1) (note 1) (note 1)
TDA5330T
UNIT dB MHz dB k
Fig.4 S11 of the band A mixer input (40 to 220 MHz).
January 1988
9
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
TDA5330T
Fig.5 S11 of the band B mixer input (150 to 500 MHz).
Fig.6 S11 of the band C mixer input (450 to 900 MHz).
January 1988
10
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
TDA5330T
Fig.7 S11 of the LO output (50 to 900 MHz).
Fig.8 S11, S12 and S22 of the IF amplifier (30 to 60 MHz).
January 1988
11
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
TDA5330T
January 1988
12
Fig.9 Test circuit diagram.
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
Component values of the test circuit resistors R1 = 47 k R5 = 22 (SMD) R9 = 22 k capacitors C1 = 1 nF C5 = 1 nF C9 = 1 nF C13 = 15 pF (N750) C17 = 0.68 pF (SMD) C21 = 1 pF C25 = 3.3 pF (SMD) C29 = 1 pF (NPO) C33 = 1 F (40 V) diodes and IC D1 = BB911 IC = TDA5330T coils L1 = 6.5 t (3) L5 = 2 x 6 t (note 1) L2 = 1.5 t (3) L6 = 12 t (note 1) L3 = 1.5 t (3) L7 = 2 t (mounted on L6) D2 = BB909B D3 = BB405B C2 = 1 nF C6 = 1 nF C10 = 1 nF C14 = 1 nF C18 = 1 pF (SMD) C22 = 0.68 pF (SMD) C26 = 3.3 pF (SMD) C30 = 1 pF (NPO) Cm = 18 pF (N750) C3 = 1 nF C7 = 1 nF C11 = 1 nF C15 = 1 nF C19 = 100 pF (SMD) C23 = 150 pF (N750) C27 = 1.8 pF (SMD) C31 = 82 pF (N750) R2 = 18 R6 = 22 k R10 = 15 k R3 = 22 k R7 = 1 k R11 = 22 k
TDA5330T
R4 = 22 k R8 = 2.2 k
C4 = 1 nF C8 = 1 nF C12 = 15 pF (N750) C16 = 1 nF C20 = 5.6 pF (SMD) C24 = 1.8 pF (N750) C28 = 1 nF C32 = 1 nF
L4 = 1.5 t (3) L8 = 5 H (choke coil)
wire size for L1 to L4 = 0.4 and for L5 to L7 = 0.1 mm. Note 1. Coil type: TOKO 7 kN; material: 113 kN, screw core (03-0093), pot core (04-0026).
January 1988
13
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm
TDA5330T
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
January 1988
14
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
SOLDERING Introduction
TDA5330T
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
January 1988
15
Philips Semiconductors
Product specification
VHF, UHF and Hyperband mixer/oscillator for TV and VCR 3-band tuners
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA5330T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
January 1988
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